OPTICAL: Partnership for Wafer Metrology.
Publication Date: 01-DEC-03
Publication Title: NDT Update
Format: Online

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Description

KLA-Tencor and Soitec announced a joint program to improve the quality, yield, and cost of production of SOI wafers used in high- performance, low-power-consumption IC applications. According to company spokespeople, the joint development partnership (JDP) is expected to provide wafer and IC manufacturers with the industrys first wafer inspection system that is specifically optimized for SOI and meets the sensitivity requirements for the 90-nm and 65-nm nodes. The first of these new inspection systemswhich will be based on KLA-Tencors industry-leading Surfscan SP1is expected to ship to Soitec...



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