Company Profile
Updated: 19-DEC-08ASM Assembly Technology Ltd.
International Private company
23-1, 6-chome Nagayama, Tama-shi, Tokyo, 206-0025, Japan
()423376311, 423897555 fax, http://www.asm.com
Primary SIC: Semiconductors And Related Devices, Primary NAICS: Semiconductor and Related Device Manufacturing
Description: Manufacturing: Manufacturer of semiconductor processing equipments
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Patent No. 7,578,423 Issued on Aug. 25, Assigned to ASM Technology Singapore for Oxidation Reducing Assembly (Singapore Inventors)
US Fed News Service, Including US State News; 8/29/2009; 445 words; ...Singapore, have developed an assembly for reducing oxidation of semiconductor...patent has been assigned to ASM Technology Singapore Pte Ltd., Singapore. According to...amp; Trademark Office: "An assembly for reducing oxidation of a...
Patent No.7,568,606 Issued on Aug. 4, Assigned to Technology Singapore for Electronic Device Handler (Singapore Inventors)
US Fed News Service, Including US State News; 8/8/2009; 454 words; ...has been assigned to ASM Technology Singapore Pte Ltd., Singapore. According...bonding. A storage assembly is provided for storing...aligned with the storage assembly for transferring an...platform and the storage assembly." The original application...
Intel Capital Invests in ASM International N.V.; Investment Supports Semiconductor Manufacturing Innovation for Advanced Process Technology.
M2 Presswire; 5/5/2009; 760 words; ...Capital Invests in ASM International N...Advanced Process Technology(C)1994-2009 M2 COMMUNICATIONS LTD RDATE:04052009...an investment in ASM International...wafer processing, assembly and packaging of...devices. Its advanced technologies, which meet key...M2 Communications Ltd ...
Reportlinker Adds World Advanced Electronic Packaging Market Report.(Company overview)
Business Wire; 3/24/2009; 4987 words; ...Limited, STATS ChipPAC Ltd., Amkor Technology Inc., ASM International NV, ASM Pacific Technology Ltd., CARSEM, Chipbond Technology Corp, ChipMos Technologies, FlipChip International...8 Challenges Facing Assembly and Packaging II-8...
Focus on the World Advanced Electronic Packaging Market.
Business Wire; 1/8/2009; 4319 words; ...Limited, STATS ChipPAC Ltd., Amkor Technology Inc., ASM International NV, ASM Pacific Technology Ltd., CARSEM, Chipbond Technology Corp, ChipMos Technologies, FlipChip International...8 Challenges Facing Assembly and Packaging II-8...
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