Company Profile
Updated: 09-DEC-09Chips and Wafers Inc.
Private Company, Headquarters Location
5234 E Hatcher Rd., Paradise Valley, AZ 85253, United States
(480)998-1694,
Primary SIC: Electronic Parts and Equipment, Not Elsewhere Classified, Primary NAICS: Other Electronic Parts and Equipment Merchant Wholesalers
Description: Wholesale: Wholesale Electronic Parts/Equipment
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Elpida Producing 40nm 2-Gigabit DDR3 SDRAM
Wireless News; 12/24/2009; 340 words; ...stated that the new 2-gigabit DDR3 SDRAM achieves 44 percent more chips per wafer compared with Elpida's 50nm DDR3 SDRAM and a 100 percent yield...newsdesk@closeupmedia.com)) Copyright 2009 Close-Up Media, Inc. All Rights Reserved.
Research and Markets Adds Report: Status of the MEMS Industry 2009
Wireless News; 12/24/2009; 652 words; ...attracting new players like TSMC, UMC and others. In addition, wafer level packaging and 3D chip stacking using through silicon vias (TSV) are also a growth...closeupmedia.com)) Copyright 2009 Close-Up Media, Inc. All Rights Reserved.
DALSA's Piranha Linescan Camera Family Named Best of 2009 by Electronic Design Magazine.
Marketwire Canada; 12/23/2009; 1008 words; ...highly engineered semiconductor wafer processing. Products and services...software; and semiconductor wafer foundry services for use in...sensors and mixed-signal CMOS chips. DALSA is listed on the Toronto...Red Javelin Communications, Inc. Maria Doyle +1-781-964...
Elpida Memory Inc commences mass production of 40nm process 2-gigabit DDR3 SDRAMs in Hiroshima plant.
Telecomworldwire; 12/22/2009; 631 words; ...22 December 2009-Elpida Memory Inc commences mass production of 40nm...access memory supplier Elpida Memory Inc (TOKYO:6665) declared on Tuesday...gigabit DDR3 SDRAM achieves 44% more chips per wafer compared with Elpida's 50nm DDR3...
Micropelt Partners with CP&C Japan Partners
Wireless News; 12/22/2009; 371 words; ...Micropelt's thermoelectric chips are fabricated in a wafer based semiconductor manufacturing...thermoelectric generator chips (TEGs) offer a perfect...thermoelectric cooler chips (TECs), based on the...matches perfectly with the chip-size TECs of Micropelt...2009 Close-Up Media, Inc. ...
Recent News Articles
- Three New Advanced Packaging Products from Shin-Etsu MicroSi, Inc. Address Demands of Flip Chip and Wafer-Level Packaging Markets.
Business Wire - February 27, 2007 - TI Chip-Making Process to Double Output Per Wafer.(Texas Instruments Inc.)(Brief article)
eWeek - June 12, 2006 - Wafer Packaging Leader Unitive, Inc. Develops Unique Polyimide Technology Application, Boosting Chip Performance; Increased Integration in Smaller Space Produces Robust Functionality, Reliability.
PR Newswire - May 21, 2004 - WaferMasters, Inc. Awarded Key Patent and Order for Flash Annealing Technology That Enables Diffusion-Free Activation of Ultra Shallow Junctions in Chip Manufacturing.
Business Wire - April 14, 2004
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