Company Profile
Updated: 09-SEP-09Package Design and Manufacturing
Private Company, Headquarters Location
PO Box 596, Whitmore Lake, MI 48189, United States
(248)486-4390, (248)486-0701 fax,
Primary SIC: Paper Mills, Primary NAICS: Paper (except Newsprint) Mills
Description: Manufacturing: Manufactures wrapping and packaging papers; manufactures plastics materials and resins; manufactures packing materials; manufactures plastic foam products
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Alejandro Cedeno Named Vice President, Global Innovation for MWV.
NewsRx Health & Science; 11/22/2009; 1070 words; ...insights, creative design, materials science...has led product and package design efforts for global...Most recently, he led Package and Device development...MeadWestvaco Corporation, Manufacturing, Chemicals and Plastics...Forest Products, Manufacturing, MeadWestvaco Corporation...
Altera's New Cyclone IV FPGA Expands Reach of Cyclone FPGA Series.
Marketing Weekly News; 11/21/2009; 1054 words; ...power consumption and packages as small as 11x11 mm...for next-generation designs. The innovative features...protocols, simplify board design and create obsolescence...significantly simplifies PCB design and reduces board space...Mobile and Wireless, Manufacturing, Engineering, ...
First Ever True Bottle-to-Box Recycled Product, the ECO-CHIC 100% Recycled PET Bottle Box.
Food Weekly News; 11/19/2009; 1281 words; ...current in market food packages. The troubled environment...alternative to food packages. A product where the...accomplished teams in design, manufacturing and packaging to the...Bottle Box™ packages are ECO-CHIC. With...
austriamicrosystems Presents the Worldwide First FlexRay Transceiver Produced in Series, Certified to the FlexRay Specification V2.1 Rev B.
Biotech Week; 11/18/2009; 1061 words; ...austriamicrosystems. "We design and develop our...compliant SSOP20 package. For product specific...of-the-art manufacturing and test facilities...Semiconductor, Manufacturing, Automotive Manufacturing, Networks, Advertising...
Mentor Graphics Outlines Strategy to Unify Silicon Test and Yield Analysis.(Company overview)
Electronics Newsweekly; 11/18/2009; 1233 words; ...comprehensive set of design-for-test and silicon...general manager for the Design-to-Silicon Division...Various drivers are making design-for-test (DFT...sensitivity to normal manufacturing variability, introducing...characterization, wafer test, and package test), and all test...
Recent News Articles
- The Colad Group LLC, a designer and manufacturer of presentation and promotional packaging located in Buffalo, N.Y., purchased a Xeikon 6000 digital color press.(PRESS INSTALLATIONS)
Printing News - November 09, 2009 - Glass Packaging Manufacturer Anadolu Cam Cuts Design Time by 50% with Dassault Systemes' CATIA.
Business Wire - October 08, 2009 - Portola designs, manufactures and markets a range of packaging products and services.(Equipment Showcase: Caps and Closures)
Dairy Foods - September 01, 2009 - Modern Packaging designs and manufactures.(Fillers)
Dairy Foods - April 01, 2009
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