Disco Corp.

International public company
13-11 Ohmori-kita 2-chome, Ota-ku, Tokyo,  145-8580, Japan
(813)45901075, (813)45901100 fax, http://www.disco.co.jp

Primary SIC: Machine Tools, Metal Cutting Types, Primary NAICS: Machine Tool (Metal Cutting Types) Manufacturing
Description: Manufacturing: Manufacturer of semiconductor process equipment.

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Disco Corp., News and Information

JCR gives A+ to Disco Corp's debts.
ADP Debt News; 11/26/2009; 472 words; ...gave Thursday an A+ rating to the senior debts of Japan's semiconductor devices maker Disco Corp (TYO:6146). The outlook is "stable". Disco Corp is a manufacturer of semiconductor producing equipment with the core technologies being...

Patent No. 7,622,366 Issued on Nov. 24, Assigned to Disco for Semiconductor Device Manufacturing Method (Japanese Inventor)
US Fed News Service, Including US State News; 11/25/2009; 469 words; ...semiconductor device. The inventor was issued U.S. Patent No. 7,622,366 on Nov. 24. The patent has been assigned to Disco Corp., Tokyo. According to the abstract released by the U.S. Patent & Trademark Office: "A method of manufacturing...

Reportlinker Adds HB LED & HB LED Packaging.
PR Newswire; 11/3/2009; 2086 words; ...CMD, Cofan, PCB, Cookson, CREE, CTS, Daltec, Datacon, Disco, Doosan, Dow Corning, Dupont, Dynatex, Electrovac curamik...Heatron, Heraeus, Hesse & Knipps, Hymite, Hysol, Indium Corp., Intematix, ipdia, Jenoptik, JPSA, KNS, Kulicke &...

K.C. LIBRARY DIRECTOR CROSBY KEMPER INTO EDUCATION HALL OF FAME
US Fed News Service, Including US State News; 10/31/2009; 1115 words; ...five years, the one-time chairman and CEO of UMB Financial Corp., has led a Kansas City renaissance as Director of the Kansas...western music such as in the fox trot. When we left, there were discos on top of every hotel." Kemper also spent four years in New...

Patent No. 7,605,058 Issued on Oct. 20, Assigned to Disco for Wafer Dividing Method (Japanese Inventor)
US Fed News Service, Including US State News; 10/24/2009; 531 words; ...dividing method. The inventor was issued U.S. Patent No. 7,605,058 on Oct. 20. The patent has been assigned to Disco Corp., Tokyo. According to the abstract released by the U.S. Patent & Trademark Office: "A wafer dividing method...

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