Wako Pure Chemicals Industries Ltd.

Publication No. WO/2009/128448 Published on Oct. 22, Assigned to Wako Pure Chemical Industries for Novel Protein, Hyaluronic Acid Measurement Method (Japanese Inventors)
US Fed News Service, Including US State News; 10/30/2009; 403 words; ...hyaluronic acid, and method for measurement of hyaluronic acid using the same. The patent has been assigned to Wako Pure Chemical Industries Ltd., Osaka, Japan. According to an abstract posted by the World Intellectual Property Organization: "Disclosed...

Publication No. WO/2009/110582 Published on Sept. 11, Assigned to Wako Pure Chemical Industries for Semiconductor Surface Treating Agent Composition, Semiconductor Surface Treatment Method (Japanese Inventors)
US Fed News Service, Including US State News; 9/14/2009; 495 words; ...semiconductor surface using the semiconductor surface treating agent composition. The patent has been assigned to Wako Pure Chemical Industries Ltd., Osaka, Japan. According to an abstract posted by the World Intellectual Property Organization, the...

Publication No. WO/2009/104741 Published on Aug. 27, Assigned to Wako Pure Chemical Industries for Beta-Glucan Assaying Substrate, Endotoxin, Assay Method (Japanese Inventors)
US Fed News Service, Including US State News; 9/3/2009; 384 words; ...substrate for assaying beta-glucan and/or endotoxin and assay method. The patent has been assigned to Wako Pure Chemical Industries Ltd., Osaka, Japan. According to an abstract posted by the World Intellectual Property Organization, in...

Publication No. WO/2009/081884 Published on July 2, Assigned to Wako Pure Chemical Industries for Etching Agent (Japanese Inventors)
US Fed News Service, Including US State News; 7/8/2009; 435 words; ...from Japan, have developed an etching agent for semiconductor substrates. The patent has been assigned to Wako Pure Chemical Industries Ltd., Osaka, Japan. According to an abstract posted by the World Intellectual Property Organization, the...

Publication No. WO/2009/022644 Published on Feb. 19, Assigned to Wako Pure Chemical Industries for Negative Photosensitive Resin Composition (Japanese Inventors)
US Fed News Service, Including US State News; 3/27/2009; 387 words; ...photosensitive resin composition suitable as a photosensitive material. The patent has been assigned to Wako Pure Chemical Industries Ltd., Osaka, Japan. According to an abstract posted by the World Intellectual Property Organization, the...