Carsem Sdn Bhd

U. S. INTERNATIONAL TRADE COMMISSION ISSUES NOTICE IN MATTER OF CERTAIN ENCAPSULATED INTEGRATED CIRCUIT DEVICES, PRODUCTS CONTAINING SAME
US Fed News Service, Including US State News; 11/4/2009; 897 words; ...in connection with several claims of three U.S. patents owned by Amkor. The complainant named Carsem (M) Sdn Bhd; Carsem Semiconductor Sdn Bhd; and Carsem, Inc. (collectively, "Carsem") as respondents. On November 9, 2005, the...

U.S. INTERNATIONAL TRADE COMMISSION ISSUES NOTICE IN MATTER OF CERTAIN ENCAPSULATED INTEGRATED CIRCUIT DEVICES, PRODUCTS CONTAINING SAME
US Fed News Service, Including US State News; 7/3/2009; 1112 words; ...in connection with several claims of three U.S. patents owned by Amkor. The complainant named Carsem (M) Sdn Bhd; Carsem Semiconductor Sdn Bhd; and Carsem, Inc. (collectively, "Carsem") as respondents. The Commission has been unable...

TI Texas Recognizes Suppliers for Excellence and Outstanding Support
Wireless News; 4/12/2009; 443 words; ...Company Product or Service Applied Materials, Inc. Capital equipment AGS Division - Applied Global Services Carsem (M) Sdn. Bhd. (M-Site) Subcontract assembly and test services Cross-link Electric & Construction Mechanical and...

Texas Instruments recognizes 13 suppliers for excellence and outstanding support.
PR Newswire; 4/7/2009; 817 words; ...Applied Materials, Inc. Capital equipment AGS Division - Applied Global Services Carsem (M) Sdn. Bhd. (M-Site) Subcontract assembly and test services Cross-link Electric & Construction Mechanical and...

Malaysian Inventors Develop Integrated Circuit Package Encapsulation Mould
US Fed News Service, Including US State News; 5/5/2008; 535 words; ...disclosed." The inventors were issued U.S. Patent No. 7,351,611 on April 1. The patent has been assigned to Carsem (M) Sdn Bhd, Perak. The original application was filed on June 15, 2004, and is available at: http://patft.uspto...