Company Profile
Updated: 24-MAR-09Advanced Packaging Technology (M) Bhd.
International public company
23B Jalan 52/1, Petaling Jaya, 46200, Malaysia
()60 03 7960 0648, 60 03 7957 0094 fax,
Primary SIC: Converted Paper & Paperboard Prod Nec, Primary NAICS: All Other Converted Paper Product Manufacturing
Description: Manufacturing: Manufacture of flexible packaging materials. ISO 9001 certified
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MALAYSIA DEEPENS ITS ELECTRICAL & ELECTRONICS SECTOR.
AsiaPulse News; 8/17/2009; 1273 words; ...areas are advanced analog, radio...Science, Technology and Innovation...Microelectronics (M) Sdn. Bhd), STATs...Malaysia Sdn Bhd. In continuations...integrated circuit technologies, processes...Semiconductor Process Technology, IC Packaging, Test, and...
Malaysia Deepens Its Electrical & Electronics Sector.
PR Newswire; 8/14/2009; 1091 words; ...areas are advanced analog, radio...Science, Technology and Innovation...Microelectronics (M) Sdn. Bhd), STATs...Malaysia Sdn Bhd. In continuations...integrated circuit technologies, processes...Semiconductor Process Technology, IC Packaging, Test, and...
Machinery exhibition expected to generate US$100m sales
New Straits Times; 7/24/2008; 430 words; ...Event Management Sdn Bhd chairman Mahmud Mohd...exhibitions are 12,000 sq m. Mahmud said the exhibition...to discover new and advanced innovative technology and machinery in the...manufacturing, production and packaging industries. Both events...
Unisem and FlipChip International Ink Licensing Pact
Wireless News; 6/21/2008; 460 words; ...Unisem (M) Berhad...Advanpack Technologies Sdn Bhd (UAT) announced...wafer level packaging technologies. As part...s core technologies, including...premier Spheron technology. FCI will...handheld advanced mobile devices...
Unisem and FlipChip International Sign Licensing Agreement for Wafer Bumping and Wafer Level Packaging Technologies.
Business Wire; 6/16/2008; 879 words; ...Unisem (M) Berhad...Advanpack Technologies Sdn Bhd (UAT) announced...wafer level packaging technologies. As part...s core technologies, including...Spheron[TM] technology. FCI will...handheld advanced mobile devices...
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