Company Profile
Updated: 17-SEP-09Flip Chip Technologies
Private Subsidiary, Headquarters Location
3701 E University Dr., Phoenix, AZ 85034-8225, United States
(800)4225542, (602)431-4717, (602)385-3672 fax, http://www.flipchip.com
Primary SIC: Special Industry Machinery, Not Elsewhere Classified, Primary NAICS: All Other Industrial Machinery Manufacturing
Description: Manufacturing: Manufactures packaging materials, and test interconnect solutions.
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Renesas Debuts Ternary Content Addressable Memory Family for Multi- Layer Packet Processing in Networking Equipment
Wireless News; 12/22/2009; 362 words; ...Processing in Networking EquipmentType: NewsRenesas Technology America, Inc. announced it has introduced its Ternary...cascade connections. The package is a 576-pin FCBGA (flip chip BGA) measuring 27 mm - 27 mm. ((Comments on this...
TVs To Push 3D, Green Design, Interactivity At CES.
TWICE; 12/21/2009; 926 words; ...digital television technology as the category takes...leader in the widgets technology space, observed...from validating the technology to increasing distribution...initiated by Cisco's Flip Video, Kodak and others...of new CMOS imaging chip technologies to make photo taking...
Renesas Releases Its Ternary CAM Series.
Health & Beauty Close-Up; 12/20/2009; 470 words; Renesas Technology America, Inc. announced it has introduced its Ternary CAM Series...Mbits through cascade connections. The package is a 576-pin FCBGA (flip chip BGA) measuring 27 mm - 27 mm. ((Comments on this story may be sent...
MoSys Announces Availability of Silicon Proven 40nm DDR3 and DDR3/2 Combo PHYs with Support for Datarates up to 2133 Mbps.
Marketing Weekly News; 12/19/2009; 1005 words; ...package and 2133Mbps in flip chip packaging, making...Engineering for Mindspeed Technologies. "We selected the...Flash[R] memory technologies offer a combination...other available memory technologies for a variety of networking...Networks, Other Technology, Semiconductor, Software...
United States : Infinova Introducing a New Family of IP/Megapixel Products, High Speed, High Definition PTZ Dome, at ISC West.
TendersInfo; 12/17/2009; 737 words; ...features Texas Instruments Da Vinci chip; includes fixed, mini-dome and high...degree continuous pan with vertical auto flip provides smooth movement, high sensitivity...Based on Texas Instruments' Da Vinci technology (DM355), integrators will be able to...
Recent News Articles
- FlipChip International Announces Next Generation Adaptable NANOPillar Bumping Technology for Lead-Free Fine Pitch Flip Chip and 3D Packaging Applications.
Biotech Week - November 25, 2009 - FlipChip International Announces Next Generation Adaptable NANOPillar(TM) Bumping Technology for Lead-Free Fine Pitch Flip Chip and 3D Packaging Applications.
PR Newswire - November 09, 2009 - Datacard Group and Golden Spring Technology Development Jointly Offer Contactless Smart Card, Smart Label and Flip Chip Package Solution in Asia Pacific.
China Business Newsweekly - May 12, 2009 - Datacard Group and Golden Spring Technology Development Jointly Offer Contactless Smart Card, Smart Label and Flip Chip Package Solution in Asia Pacific.
Business Wire - April 22, 2009
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