Datacon Technology GmbH

Dutch BESI announces management board change.
ADP News Netherlands; 9/2/2009; 390 words; ...the company added. As part of BESI's executive board, Rutterschmidt headed the company's Austrian unit Datacon Technology GmbH. His responsibilities will be taken over by BESI's present chief executive officer Richard Blickman.

Flip-Chip Bonder.
Semiconductor International; 6/1/2008; 336 words; ...solder bumps and other advanced packaging processes. The system offers users fully automatic calibration, short conversion time, reject detection and a SECS/GEM data link. Datacon Technology GmbH , Radfeld, Austria, www.datacon.at

Die Bonder.(Datacon Technology GmbH's 2200 evo )(Brief article)
Semiconductor International; 10/15/2006; 703 words; ...different ejection tools are additionally available in one module. The system is also a flip-chip bonder with a handling range from 250 [micro]m small up to 50 mm large dies. Datacon Technology GmbH, Radfeld, Austria, www.datacon.com

Identify the Key & Niche Companies Operating in the Worlds Advanced Electronic Packaging Market.
M2 Presswire; 8/30/2006; 1061 words; ...Engineering Group, Amkor Technology, Inc., ASAT Holdings...Advanced Interconnect Technologies (Singapore) - Advanced...Taiwan) - Amkor Technology, Inc (USA) - Analog...Chipscale, Inc (USA) - Datacon Semiconductor Equipment GmbH (Austria) - Dupont Electronic Technologies (USA) - ...

Identify the Key & Niche Companies Operating in the World's Advanced Electronic Packaging Market.
Business Wire; 8/30/2006; 973 words; ...Engineering Group, Amkor Technology, Inc., ASAT Holdings...Advanced Interconnect Technologies (Singapore) - Advanced...Taiwan) - Amkor Technology, Inc (USA) - Analog...Chipscale, Inc (USA) - Datacon Semiconductor Equipment GmbH (Austria) - Dupont Electronic Technologies (USA) - ...