Debond Corp.

Computers that even soldiers can't break.(INSIDE SCIENCE + TECHNOLOGY)
National Defense; 4/1/2009; 1136 words; ...Colaneri. Through a process called "bond-debond," thin pliable materials such as specialty...electronic paper" display made by E-Ink Corp. L-3 Communications has incorporated Universal Display Corp.'s organic light emitting diode, or...

California Inventors Develop Structure Planarization Method
US Fed News Service, Including US State News; 9/10/2007; 557 words; ...steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto...patent has been assigned to International Business Machines Corp., Armonk, N.Y. The original application was filed on June...

Pennsylvania Inventor Develops Adhesive Work Holding System
US Fed News Service, Including US State News; 2/7/2007; 518 words; ...a system and a method by which workpieces are bonded to and debond from a manufacturing fixture using a radiation responsive adhesive...Feb. 6. The patent has been assigned to Penn State Research Corp., University Park, Pa. The original application was filed...

PATENTS.(BUSINESS)
Wisconsin State Journal (Madison, WI); 6/6/2002; 2778 words; ...Milwaukee ASSIGNEE: Eaton Corp., Cleveland, OH TITLE: DEVICE...Shorewood ASSIGNEE: Eaton Corp., Cleveland, OH TITLE: SYSTEM...Mazomanie ASSIGNEE: Promega Corp., Madison TITLE: METHODS...MI TITLE: IN SITU-FORMED DEBOND LAYER FOR FIBERS PATENT NO...

PATENTS.(Business)
Wisconsin State Journal (Madison, WI); 6/22/2000; 2474 words; ...ND. ASSIGNEE(s): Case Corp., Racine, WI. TITLE: PRECISION...IL. ASSIGNEE(s): Case Corp., Racine, WI. TITLE: FIVE...ASSIGNEE(s): A O Smith Corp., Milwaukee, WI. TITLE...WI. TITLE: IN SITU-FORMED DEBOND LAYER FOR FIBERS PATENT NO...