Company Profile
Updated: 09-DEC-09Dimensional Circuits
Private Company, Headquarters Location
9927 Aviary Dr., San Diego, CA 92131, United States
(858)549-4290, (858)549-4292 fax,
Primary SIC: Electronic Components, Not Elsewhere Classified, Primary NAICS: Other Electronic Component Manufacturing
Description: Manufacturing: Manufacturing Electronic Components Manufacturing Printed Circuit Boards
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The fast king of Scotland.(Dario Franchitti)(Viewpoint essay)
Racer; 1/1/2010; 905 words; ...smarts. However, to be successful they needed to be multi-dimensional and one of those dimensions was raw speed. Since he won the...taking pole position by a quarter-second at Toronto--a circuit he hadn't raced on in seven years. With five wins and five...
Polar Adds Speedflex Flex-Rigid PCB Capability to the Speedstack Layer Stackup Design System.
Journal of Engineering; 12/16/2009; 952 words; ...display the stacks as a two or three-dimensional image, and add controlled impedance...fabrication and testing of printed circuit boards (PCBs). Their innovative tools...Keywords: Advertising, Asia, China, Circuit Board, Electronics, Engineering, Hardware...
Richer soundstage over wider area
New Straits Times; 12/14/2009; 443 words; ...that not only covers a wide area, but also offers a three- dimensional stereo presentation. Most speakers can only disperse middle...acoustics. This is possible through three- position equalisation circuits for both low and high frequencies with a fine-tuning range...
Publication No. WO/2009/148055 Published on Dec. 10, Assigned to Hamamatsu Photonics for Solid-State Image Pickup Device (Japanese Inventor)
US Fed News Service, Including US State News; 12/11/2009; 494 words; ...unit, first signal output circuit, second signal output circuit, first control circuit and...AI,J arranged in two-dimensional fashion in I rows and J columns...aM,N arranged in two-dimensional fashion in M rows and N columns...
Publication No. WO/2009/148054 Published on Dec. 10, Assigned to Hamamatsu Photonics for Solid State Imaging Device (Japanese Inventor)
US Fed News Service, Including US State News; 12/11/2009; 447 words; ...reception unit, a first signal output circuit, a second signal output circuit, a first control circuit, and a second control circuit. The light...plurality of rows or columns in the two-dimensional arrangement in a region different from...
Recent News Articles
- Austrian provider of semiconductor wafer-processing solutions EV Group has joined with Applied Materials, a specialist in nanomanufacturing technologies based in California, US, to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs), a new approach to increase packaging density by vertically stacking chips in three-dimensional integrated circuit packaging solutions.(Projects & Technology)(Brief article)
Chemistry and Industry - August 10, 2009 - Oki Electric Cable Introduces 3D FPC.(three-dimensional flexible printed circuit cable board)
Wireless News - June 12, 2008 - Ink jet printing for high-frequency electronic applications: nanoparticle inks and drop-on-demand ink jet printers offer a unique opportunity to generate fine-line additive circuits on flexible, three-dimensional substrates.(INK JET PRINTING)
Printed Circuit Design & Manufacture - October 01, 2007 - Ziptronix Revolutionizes Chip Interconnect for Three-Dimensional Integrated Circuits; New technology spurs greater integration, higher performance, and a scalable methodology to enable more than 4 million connections between bonded chips.
Business Wire - October 17, 2005
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