Conductive Circuits Inc.

Study results from Tsinghua University update understanding of microwave research.
Journal of Technology; 12/15/2009; 809 words; ...element equivalent-circuit ( PEEC) model for general...magnetized current in conductive magnet and fictitious...conduction loss effect of a conductive magnet." "Corresponding equivalent circuits are derived. The magnetic...Element Equivalent-Circuit Model for 3-D Structures...Electronics ...

Micro Power Awarded Two New Patents for Battery Pack Technology.
Business Wire; 12/8/2009; 1046 words; ...both a primary protection circuit and a redundant protection circuit. The components of the...nickel strips and other conductive members within the battery...Micro Power Electronics, Inc. Micro Power Electronics, Inc. is ISO 13485 and 9001...

Publication No. WO/2009/144678 Published on Dec. 3, Assigned to Kimberly-Clark Worldwide for Conductive Web (American Inventors)
US Fed News Service, Including US State News; 12/4/2009; 431 words; ...America, have developed a conductive web. The patent has...Clark Worldwide, Inc., Winchester Road...apparatuses employing a conductive nonwoven web. Products...flexible electronic circuit component, a heating...one embodiment, the conductive nonwoven web contains...

Patent No. 7,624,500 Issued on Dec. 1, Assigned to Lexmark International for Multi-layer Circuits Printing (Kentucky Inventors)
US Fed News Service, Including US State News; 12/2/2009; 452 words; ...Lexmark International Inc., Lexington, Ky...disclosure relates to circuits and methods for the manufacture of circuits, such as those which...of undesirable short circuit paths. One such method...composition receiving layers, conductive layers, and dielectric...provision of printed ...

Patent No. 7,626,252 Issued on Dec. 1, Assigned to Micron Technology for Multi-chip Electronic Package (California, Vermont Inventors)
US Fed News Service, Including US State News; 12/2/2009; 442 words; ...has been assigned to Micron Technology Inc., Boise, Idaho. According to the abstract...comprised of a plurality of integrated circuit chips secured together in a stack formation...enclosure comprises a pressurized, thermally conductive fluid, which is utilized for cooling...