Semiconductor Hybrid Assembly

Private Company, Headquarters Location
28065 Oakland Oaks Ct., Wixom, MI 48393, United States
(248)596-9050, (248)348-3992 fax, http://www.shainc.net

Primary SIC: Printed Circuit Boards, Primary NAICS: Printed Circuit Board Manufacturing
Description: Manufacturing: Manufacturing Printed Circuit Boards

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Semiconductor Hybrid Assembly, News and Information

Skyworks to Present at Upcoming Investor Technology Conferences.(Conference news)
Business Wire; 11/30/2009; 1414 words; ...and mixed signal semiconductors enabling a broad...and mixed signal semiconductors. Leveraging core...front-end modules, hybrids, infrastructure...susceptibility of the wireless semiconductor industry and the...of our third party semiconductor foundries and other...the fabrication, ...

TOP ECONOMIC INVESTMENTS IN MICHIGAN, 2008-2009.(NEWS)(List)
Crain's Detroit Business; 11/16/2009; 1165 words; ...park on site of Ford Wixom Assembly Plant; $1.33 billion; Wixom Hemlock Semiconductor Corp.: Expansion of silicon...Solutions L.L.C.: Hybrid vehicle battery plant...after-treatment system assembly plant; $60 million...

Studies from Ajou University in the area of nanotechnology published.
Nanotechnology Weekly; 11/9/2009; 637 words; ...fabrication of ZnO/organic hybrid light-emitting diodes in the manner of assembly. Different p-type organic semiconductors are used to form heterojunctions...independent of the organic semiconductor materials used in...in Nanotechnology (Hybrid light-emitting diodes...Nanotechnology, ...

Dionics Inc. is in the StockGuru Spotlight for November 4, 2009.
M2 Presswire; 11/4/2009; 1584 words; ...and sale of silicon semiconductor electronic products...and multi-component hybrid circuits primarily...in miniature circuit assemblies called 'hybrid micro-circuits...fluorescence. Its hybrid circuits function as...

Publication No. WO/2009/127179 Published on Oct. 22, Assigned to Conti Temic Microelectonic for Power Module Assembly, Production Method (German Inventors)
US Fed News Service, Including US State News; 10/28/2009; 460 words; ...method for producing and assembly of a power module. The...for producing and to the assembly of a power module, particularly...power module for use in hybrid and/or electric vehicles, wherein at least one semiconductor element is soldered into...

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