Metal Fabricating Corp.

CHINA COMPLETES 1ST 36,000-TON VERTICAL EXTRUDER WORLDWIDE
AsiaInfo Services; 11/16/2009; 384 words; ...North Heavy Industries Group Corp., Ltd. and Tsinghua University...treatment, machining, instrument fabricating, and commissioning.Source...HOHHOT INDUSTRY KEYWORD: Metals & Mining & Chemicals SUBJECT CODE: Metal & Mining Metal Ore Mining SinoCast China Business...

Patent No. 7,616,267 Issued on Nov. 10, Assigned to AU Optronics for Pixel Structure For Flat Panel Display (Taiwanese Inventor)
US Fed News Service, Including US State News; 11/11/2009; 487 words; ...assigned to AU Optronics Corp., Hsinchu. According...comprising a lower metal layer, an upper metal layer and a capacitor...substrate. The upper metal layer and the gate electrode...discloses a method for fabricating the pixel structure...

Publication No. WO/2009/120749 Published on Oct. 1, Assigned to Argen for Cad, Cam Milling Process (American Inventors)
US Fed News Service, Including US State News; 11/9/2009; 417 words; ...has been assigned to Argen Corp., Oberlin Drive San Diego...Organization: "A method for fabricating a dental device using an improved...from blanks made of a mix of metal powders and a polymer binder...inherent when using mixes of metal and polymer powder to ensure...

Patent No. 7,611,929 Issued on Nov. 3, Assigned to Innolux Display for Tft Array Substrate Fabrication Method (Taiwanese Inventors)
US Fed News Service, Including US State News; 11/4/2009; 471 words; ...have developed a method for fabricating tft array substrate. The inventors...assigned to Innolux Display Corp., Miao-Li County, Taiwan...An exemplary method for fabricating a thin film transistor (TFT...layer, and a source/drain metal layer on the insulating substrate...

Patent No. 7,608,929 Issued on Oct. 27, Assigned to Phoenix Precision Technology for Electrical Connector Structure (Taiwanese Inventor)
US Fed News Service, Including US State News; 11/4/2009; 498 words; ...Precision Technology Corp., Hsin-Chu. According...board and a method for fabricating the same are proposed...electrical connection pads and metal bumps on the electrical...electrical connection pads and metal bumps, and the exposed...connection pads and the metal bumps. Then, the second...