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Hermes European Embedded Die Consortia Selects FlipChip International's EDC Embeddable Die Customization Technology.

Publication: Journal of Technology
Publication Date: 21-JUL-08
Format: Online
Delivery: Immediate Online Access

Article Excerpt
Hermes, the European consortia for the development and industrialization of embedded die technology has announced FlipChip International, LLC as an associate partner. Following the successful launch of FlipChip International's EDC (TM) (Embeddable Die Customization (TM)) technology in November, 2007, Hermes has decided to leverage this capability to enable realization of a solution for heterogeneous systems integration.

The Hermes Consortia, launched on...

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