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Holewall pullaway and resin recession: maintaining the electroless copper process chemistry within recommended range can alleviate many common plating problems.

Publication: Printed Circuit Design & Manufacture
Publication Date: 01-APR-08 		Format: Online
Delivery: Immediate Online Access
Full Article Title: Holewall pullaway and resin recession: maintaining the electroless copper process chemistry within recommended range can alleviate many common plating problems.(POSITIVE PLATING)

Article Excerpt
WE DEVOTED THE last several columns to voids and holewall pullaway. Before moving on to discuss other defects, this edition will discuss resin recession and finish with a case study on Holewall Pullaway (HWPA). While they are two unrelated issues--one is a defect and the other is not--both will receive appropriate discussion.

Resin recession is primarily a material issue, not a plating/metallization defect. On casual inspection, resin recession can be, and often is, confused with HWPA. Resin shrinks during solder shock and other thermal excursions, and resin that is not completely cured will be more prone to shrinkage.

An example of resin recession is shown in FIGURE...

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