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Voids, part 3: the best defense against voids is to understand the processes that can cause the defect.

Publication: Printed Circuit Design & Manufacture
Publication Date: 01-MAR-08 		Format: Online
Delivery: Immediate Online Access
Full Article Title: Voids, part 3: the best defense against voids is to understand the processes that can cause the defect.(POSITIVE PLATING)

Article Excerpt
IN THIS EDITION of Positive Plating, we will discuss voids that are directly attriuted to the electroless deposition process.

Voids in the electroless copper deposit can be caused by a variety of reasons, but incorrect or improper maintenance of chemical concentrations or operating parameters are most often the culprits. Assuming that the desmear operation and drilling are within specifications, the next step is to concentrate on the electroless copper process itself. It is important to recognize that the PTH process is an integrated operation. This means that the various process steps are interdependent on each other. For example, the cleaner-conditioner step influences the degree of catalyst adsorption, which in turn influences copper deposition. Thus, one can still produce voids...

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