Publication: NDT Update
Publication Date: 01-FEB-04
Delivery: Immediate Online Access
Author:
Company: Robotic Vision Systems Inc.
Article Excerpt
In three separate news releases, Robotic Vision Systems, Inc. (RVSI) said it has received orders for its WS-series bumped wafer inspection system from a major Japanese semiconductor company, another one from a large semiconductor company, and one from a Korean company.
The Japanese order, the first WS-series system to be purchased for this organization, will be used specifically for surface defect inspection of bumped wafers that have been fabricated by the semiconductor company. Depending on wafer size and other features, the WS-series is priced from $500,000 to more than $1 million per system. The system is scheduled to ship in April 2004.
Bob Michaels, vice president, sales for RVSIs Semiconductor Equipment Group in Hauppauge, New York, said the orders importance was in the selection of RVSI for 2-D inspection requirements. There is little question that were the industrys standard for 3-D bump-height wafer metrology, Michaels says. This order demonstrates that we are...
NOTE: All illustrations and photos have been removed from this article.
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