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Publication: NDT Update
Publication Date: 01-JAN-04
Delivery: Immediate Online Access
Author:
Company: ADE Corp.

Article Excerpt
ADE Corp. announced the introduction of its new EdgeCheck option and wafer Backside Quality Monitor to identify and sort on wafer edge defects and backside particles during the surface inspection process. These edge chips, defects, and particles can contaminate downstream semiconductor processes, reducing yields. Catastrophic failures, such as wafer breakage during thermal processing, can also be traced to chips on the edge of the wafer. These new products were introduced in December at SEMICON...

NOTE: All illustrations and photos have been removed from this article.



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