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RESEARCH: In situ Reliability Measurements.

Publication: NDT Update
Publication Date: 01-AUG-03
Format: Online - approximately 279 words
Delivery: Immediate Online Access

Article Excerpt
Researchers at the Packaging Research Center of Georgia Institute of Technology have published a paper on in situ stress and warpage measurements of flip-chip on-board assemblies to investigate reliability. The paper appears in the Proceedings of Electronic Components and Technology organized...

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...Conference by IEEE (May 27-30, 2003, held in...

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