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...provider instruments, components, and subsystems that measure, control, power, and monitor vital parameters semiconductor and other advanced manufacturing process environments-has enhanced its line of HPS vacuum sensing products by introducing new vacuum transducers that offer integrated electronics, digital communications, and smaller size. Moreover, three of the new products use micromachining technology, and two of the new offerings provide two different types of sensors plus electronics in a single unit.
The new HPS line of digital transducers encompasses a miniature micromachined MicroPirani(tm) gauge for low to high vacuum measurement, micromachined Piezo sensors for medium vacuum to atmospheric sensing, and a miniaturized ionization sensor that features hot cathode technology and integrated electronics control for medium to ultra-high vacuum measurement.
"Our new line of MEMS-based transducers are innovative in that they use new solid-state designs and provide real-time access to process data," stated Bill Stewart, vice president and general manager of MKS, HPS Products. "MEMS-based transducers replace sensors with older output technologies. The compact size reduces system footprint requirements, as well as expense to the overall system, often replacing up to three gauges on a system. Our new transducer line brings higher levels of vacuum gauge integration to the end-user."
Cynthia Boyd, director of sales and marketing for MKS' HPS Products, explained that OEM semiconductor tool manufacturers, the main customers for the HPS line of vacuum products, increasingly require lower-cost, smaller sensors with a digital interface, as the semiconductor tools themselves continue to get smaller and increasingly have a digital interface. Moreover, vacuum sensing devices, consisting of multiple sensors and electronics in a single package, will become increasingly attractive to semiconductor tool makers, since sensors provide a miniaturized "system-on-a-chip" solution and can reduce the OEM's connection and implementation costs.
The HPS Series 901 loadlock transducer is a dual-sensor device that combines a micromachined MicroPirani vacuum gauge, a micromachined Piezo differential atmospheric pressure sensor, and an integrated electronic control circuit in a single package.
Loadlocks are a key component of semiconductor tools, serving as an interface to the continuously pumped main chamber. The loadlocks are often to pumped to high vacuum levels very quickly, which can overwhelm traditional Pirani gauges, due to their slower response time. When the loadlock is brought up to atmosphere, a separate switch has typically been used to indicate when the door can be opened.
The new, streamlined loadlock transducer is aimed at semiconductor original equipment manufacturers (including loadlock manufacturers); and it is designed to the provide the equipment designer with such benefits as enhanced flexibility, a convenient modular configuration, space savings, reduced process cycle time as a result of rapid, accurate, and repeatable pressure measurements,...
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