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Article Excerpt
Silicon Microstructures, Inc. (SMI, Milpitas, CA, 408-577-0100)(www.si-micro.com), a manufacturer of MEMS-based silicon (primarily piezoresistive) pressure sensors, accelerometers, and custom microstructures for varied medical, industrial, and automotive applications, has developed and released several new silicon pressure sensors that leverage SMI's ability to produce more cost-effective sensors on 6" wafers and use inexpensive packages that are conducive to high-volume applications. Qualified prototypes of the new pressure sensors (the SM5420, SM5470, and SM 5430) have been delivered, and SMI has been gearing up for production of the new sensors.
In addition, SMI's SM5822/58772 monolithic, co-integrated pressure sensors, which combine CMOS/ EEPROM signal conditioning along with a silicon pressure sensor on a single chip, have been qualified at key customer sites and initial products are being built using 6" wafers.
Dr. Jim Knutti, SMI's president and CEO, noted that the new packaged pressure sensors, and the high-performance, amplified, calibrated and fully signal conditioned smart pressure sensors, are emblematic of SMI's strategy of providing sensors that deliver cost and performance benefits that enable customers to create enhanced, value-added system-level products and solutions.
Moreover, SMI began producing (primarily non-co-integrated) pressure sensors on 6" wafers circa this summer. The ability to efficiently produce sensors on 6" wafers allows for considerably boosting production capacity along with reducing the per-unit cost of production, resulting in lower-cost sensors that meet tight performance specifications. Furthermore, the use of 6" wafers facilitates efficient, high-volume production of smart, co-integrated sensors. The co-integrated pressure sensors are produced on 6" wafers from Elmos Semiconductor AG (Dortmund, Germany)(FSE:ELG), SMI's parent. The wafers contain CMOS and EEPROM signal processing, compensation, and...
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