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NDT of Silicon Carbide Wafers.

Publication: NDT Update
Publication Date: 01-DEC-03
Format: Online - approximately 323 words
Delivery: Immediate Online Access

Article Excerpt
Competitive Technologies, Inc. announced that it has signed an exclusive agreement with the University of South Carolina Research Foundation (USCRF) to license and commercialize a new method of nondestructive defect delineation in silicon carbide (SiC) wafers. Developed at the Electrical Engineering, and Computer Science and Engineering Departments of the...

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