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ADE Intros Wafer Surface Inspection.

Publication: NDT Update
Publication Date: 01-DEC-03
Format: Online - approximately 499 words
Delivery: Immediate Online Access

Article Excerpt
ADE Corporation announced the introduction of its new EdgeCheck option and wafer Backside Quality Monitor to identify and sort on wafer edge defects and backside particles during the surface inspection process. These edge chips, defects, and particles can contaminate downstream semiconductor processes, reducing yields. Catastrophic failures, such as wafer breakage during thermal processing, can also be traced to chips on the edge of the wafer. These new products were introduced last week at SEMICON...

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