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Studies from Dai Nippon Printing Co., Ltd. provide new data on packaging technology.

Publication: Journal of Technology
Publication Date: 14-JUL-09
Format: Online
Delivery: Immediate Online Access
Full Article Title: Studies from Dai Nippon Printing Co., Ltd. provide new data on packaging technology.(Report)

Article Excerpt
"This paper reports the development of thin film passive elements embedded within the interlayer of a silicon interposer," scientists in Chiba, Japan report.

"Thin film resistors were developed using a seed layer formed by the sputter semi-additive method. Inductor coils were designed as spiral coils, using Benzocyclobutene as the...



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